STRATOS S810-X52L (4-Node)

Ultra Dense High Computing Multi-node 2U Rackmount Server

  • Ultra-Dense Design with High Computing and Low Energy Draw
  • Shared Power and Cooling
  • Enhanced I/O Scalability and Flexibility
EOL

* Limited Availability * 
Please contact a local distributor or QCT local office for the product availability and support.

 

  • 3rd Gen Intel Scalable processor

Ultra Dense High Computing Multi-node 2U Rackmount Server

Having 2x the computing density of traditional 2-way servers, the Quanta STRATOS S810-X52L is the densest multi-node 2U server in the market. It offers four individual 2-socket server nodes in a 2U rack chassis with node capable of populating up to 16 DIMM slots. The system features extremely high density, unsurpassed performance, and energy efficiency from shared power and cooling modules. The S810-X52L is Intel® Xeon® processor E5-2600/ E5-2600 v2 product family-based server platform, boosting its general performance by up to 80% over a previous generation Intel® Xeon® processor-based server, making it ideal for HPC, clustering, cloud infrastructure and datacenters demanding high computing and memory density.

Ultra-Dense Design with High Computing and Low Energy Draw

The STRATOS S810-X52L contains four independent hot-pluggable half-sized server nodes. Each node supports one or two 12-core Intel® Xeon® processor E5-2600/ E5-2600 v2 product family and 16 DDR3 DIMMs, which is the densest 2U server populating totally 64 DIMM slots in the market. Each S810-X52L node enables up to 2 times better technical computing performance with Intel® AVX and new Intel® Turbo Boost Technology, while getting up to 50% more performance per watt than previous generations. It also supports low-voltage DIMMs to lower datacenter operation costs with the least energy consumption and superb computing performance.

Shared Power and Cooling

The S810-X52L is designed to balance the usage of two hot-plug redundant power supplies, fans, backplanes to support four nodes. The unique design provides remarkable energy/cooling efficiency and infrastructure investment savings.

Enhanced I/O Scalability and Flexibility

The S810-X52L multi-node server provides extraordinarily flexible and scalable I/O configurations. It offers 2.5" and 3.5" 3Gb/6Gb HDDs or SSD options. Each node also provides the option of a USB flash module for OS installation. Its onboard network has choices between two GbE or 10GbE RJ45 ports. Customers can select the configuration that works best with their datacenter networking environment.

Expansion options include onboard Intel® SAS/RAID upgrade ROM, one standard PCIe x16 slot, and one PCIe x16 mezzanine slot for SAS/RAID or 10GbE SFP+ adaptor. By supporting PCIe 3.0, it improves I/O bandwidth up to 2 times from previous generation. I/O latency is also dramatically reduced with Intel® integrated I/O and Data Direct I/O technology, which helps datacenters eliminate data bottlenecks, streamline operations, and increase agility.

Certification
  • BSMI--Taiwan--EMISafety
  • CB-EU
  • CE-EU
  • Microsoft Windows 2012
  • Microsoft Windows  2012 R2
  • Microsoft Windows 2008
  • Microsoft Windows 2008 R2
  • FCC-ClassA-US
  • RHEL-5.10RHEL6.5RHEL7.0
  • RedHat-54
  • VCCI-classA-Japan この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すると電波妨害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要求されることがあります
  • VMWare ESXi5.1-Update2ESXi 5.5-Update1
Processor
Processor Family
Intel® Xeon® processor E5 product family
Processor Type
Intel® Xeon® processor E5-2600 product family
Intel® Xeon® processor E5-2600 v2 product family
Max. TDP Support
130W or 135W*
* Restriction applies. Please contact Quanta Sales representive regarding 135W support
Number of Processors
2 Processors
Internal Interconnect
6.4 / 7.2 / 8.0 GT/s
L3 Cache
Up to 30MB
Form Factor
Form Factor
2U
4 Nodes
Dimensions
W x H x D (inch)
17.6 x 3.4 x 30.5
W x H x D (mm)
447 x 87 x 775
Chipset
Chipset
Intel® C602
Storage
Default Configuration
2.5" Hot-plug
3.5" Hot-plug
Options
Option 1: (24) 2.5" hot plug
Option 2: (12) 3.5" hot plug
Memory
Total Slots
16
Capacity
Up to 256GB RDIMM
UP to 512G LRDIMM
Memory Type
1866/1600/1333 MHz DDR3 RDIMM
1600 MHz DDR3 LRDIMM
Memory Size
16GB, 8GB RDIMM
32GB LRDIMM
Expansion Slot
Default Configuration
(1) PCIe Gen3 x16, LP MD-2
(1) PCIe Gen3 x16 mezzanine slot
Network Controller
LOM
Option 1:
Intel® I350 dual-port 1 GbE per node
Dedicated 10/100 management port per node
Option 2:
Intel® X540 dual-port 10GbE BASE-T per node
Dedicated 10/100 management port per node
Optional NIC
Please refer to our Compatible Component List for more information
Storage Controller
Onboard
(4) Intel® C602:
(4) SATA 3Gb/s ports
(2) SATA 6Gb/s ports
SATA RAID 0, 1, 5, 10
SAS RAID 0, 1, 5, 10 enabled with upgrade ROM options
Optional Controller
Please refer to our Compatible Component List for more information
Power Supply
Power Supply
(2) high efficiency hot-plug 1400W PSU, 80 Plus Gold
or
(2) high efficiency hot-plug 1600W PSU, 80 Plus Platinum
Onboard Storage
Onboard Storage
Support UFM
Fan
Fan
(4) system fans
Video
Video
Integrated AST2300 with 8MB DDR3 video memory
System Management
System Management
IPMI v2.0 Compliant, on board "KVM over IP" support
Quanta Datacenter Manager 2.0/QDCM 2.0 (Optional)
Rear I/O
Rear I/O
(2) USB 2.0 ports
(1) VGA port
(1) RS232 serial Port
(2) 1 GbE or 10G BASE-T RJ45 port
(1) 10/100 RJ45 magement port
Operating Environment
Operating Environment
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 65°C (-40°F to 149°F)
Operating relative humidity: 50% to 85%RH.
Non-operating relative humidity: 20% to 90%RH
Weight (Max. Configuration)
Weight (Max. Configuration)
2.5": 27.3 (kg) / 60.19 (lbs)
3.5": 26.6 (kg) / 58.64 (lbs)

Installation / Setup Tips (12)

Ma Labs - Distributor

2075 North Capital Avenue, San Jose, CA 95132

http://www.malabs.com/

Phone 408-941-0808

SHI International Corp. - Reseller / System Integrator

290 Davidson Avenue, Somerset, NJ, 08873 USA

https://www.shi.com/

Phone 732-868-8724

Toll-Free 888-764-8888