Edge Server
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Find your products

  • QuantaEdge EGX77I-1U2N

    1U2N Sled Design Short-Depth Edge Server with 5th/4th Gen Intel Xeon Scalable processor and Intel® FlexRAN for vRAN Boost

    • 5th/4th Gen Intel® Xeon Scalable Processor Single Socket empowered
    • Featuring an embedded FEC accelerator for accelerating high-performance, energy-efficient vRAN development
    • Optimal computing performance and more cost-efficient with chip-down design
    • 400mm ultra-short depth for footprint minimization
    • Thermal enhancements for -40°~65°C critical environment
    • ORAN / TIP / NEBS GR63 (level 3) / GR1089 (level 3) / GR3108 (class 2) compliant
  • QuantaEdge EGX74I-1U

    QCT Carrier-grade Edge Server with 5th/4th Gen Intel Xeon Scalable processor and Intel® FlexRAN for vRAN Boost

    • 5th/4th Gen Intel® Xeon Scalable Processor Single Socket empowered
    • Featuring an embedded FEC accelerator for accelerating high-performance, energy-efficient vRAN development
    • Front access design for centralized/distributed Radio Access Network (RAN)
    • Flexible configurations and support up to three PCIe Gen5 expansion slots
    • 400mm ultra-short depth for footprint minimization
    • ORAN / TIP / NEBS GR63 (level 3) / GR1089 (level 3) / GR3108 (class 2) compliant
  • QuantaEdge EGX66Y-2U

    Multi-Access Edge Computing (MEC) 2U Server with Advanced Performance

    • 3rd Gen Intel® Xeon Scalable Processor Dual Socket empowered
    • Front access design for centralized/distributed Radio Access Network (RAN)
    • Distinguished, flexible I/O design supports up to six PCIe Gen4 expansion slots (Multiple SKUs options)
    • Support up to two dual-width GPUs for AI workload
    • 400mm ultra-short depth for footprint minimization
    • NEBS Level 3 and ORAN compliant
    • Thermal enhancements for -5°~55°C critical environment
  • QuantaEdge EGX63IS-1U

    Carrier-Grade Multi-Access Edge Computing (MEC) Server

    • 3rd Gen Intel® Xeon Scalable processor Ice Lake Single Socket empowered
    • Front access design for centralized/distributed Radio Access Network (RAN)
    • Distinguished, flexible I/O design supports up to three PCIe Gen4 expansion slots
    • 400mm ultra-short depth for footprint minimization
    • NEBS Level 3 and ORAN/OTII compliant
    • Thermal enhancements for -5~55’C critical environment