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QuantaGrid D75L-3U

Maximum GPU Density for Your AI Factories

  • 3U chassis compatible with 19” MGX 1.1 Rack, 1400A busbar with power shelves, DC-SCM Support
  • Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  • NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
  • 8x NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to three NICs for North/South traffic

The Quanta D75L-3U is a premier rack-level AI powerhouse, purpose-built for the next generation of AI Factories. By leveraging the NVIDIA MGX™ architecture and advanced liquid-cooling technology, the D75L-3U unlocks the full potential of the NVIDIA Blackwell Ultra platform. Its highly efficient, ultra-dense 3U design enables an industry-leading density of 72 GPUs per MGX rack, providing the foundation for exascale computing.

Pioneering Performance with Blackwell Ultra

  • The Power of Blackwell: Seamlessly supports the NVIDIA HGX™ B300 platform, powered by NVIDIA Blackwell Ultra GPUs. It is engineered to master the world’s most complex Generative AI workloads and Large Language Models (LLM).

  • 800G Fabric with ConnectX-8: Features onboard ConnectX-8 to enable blazing-fast 800G East-West data transfer. This massive bandwidth is critical for building massive-scale GPU clusters, ensuring zero-bottleneck communication across the fabric.

Unmatched Compute Density

  • Optimized Space Efficiency: The D75L-3U integrates the immense power of the HGX™ B300 into a compact 3U chassis, significantly reducing the physical data center footprint compared to traditional 8U or 10U air-cooled alternatives.

  • Extreme Rack-Level Scaling: Purpose-built for the NVIDIA MGX™ rack, the system accommodates up to 9 nodes per rack, achieving an optimal density of 72 GPUs.

Leveraging the NVIDIA MGX™ Ecosystem

  • Accelerate Time-to-Market: By adhering to NVIDIA MGX™ ecosystem, we ensure a stable and reliable supply of critical components—including the rack, power distribution, and cooling manifolds—drastically reducing time-to-market for large-scale deployments.

  • Serviceability & Standardized Compatibility: The D75L-3U integrates seamlessly with the MGX ecosystem, providing superior serviceability and ensuring your infrastructure remains flexible to evolve with future AI hardware generations.
处理器
Processor Family
Intel® Xeon® 6 processors
最大散热设计功耗支援
350W
处理器数量
2 Processors
主板规格
主板规格
3U
尺寸
W x H x D （毫米）
438 x 131.7 x 864.5 mm
存储
存储
(8) hot-swappable E1.S PCIe Gen5 SSD
存储器
總插槽
(32) DDR5 RDIMM up to 6,400 MHz, (16) MRDIMM up to 8,000 MHz
扩充插槽
扩充插槽
(3) FHHL SW PCIe Gen5 x16 slots
风扇
风扇
(8) 6056 fans
操作环境
操作环境
Operating temperature: 5°C to 35°C
Non-operating temperature: -40°C to 70°C
Operating relative humidity: 20% to 85%RH
Non-operating relative humidity: 10% to 95%RH

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