QuantaGrid D75E-4U

Tailored to Unlock Infinite AI Possibilities

  • Powered by dual Intel® Xeon® 6 processor
  • Supports NVIDIA next-gen PCIe GPUs, up to 8x DW AC 600W
  • Supports the latest Intel® Gaudi® 3 AI accelerators in PCIe form factor, up to 8x DW AC 600W​
  • All PCIe 5.0 expansion slots are designed to support up to 150W​
  • Remote heatsink solution for improved thermal performance​
  • Enhanced serviceability with tool-less and hot-pluggable designs
  • Offers infinite flexibility to support any AI/HPC-related workloads​
  • wd
  • redhat

技术支持来自

  • 3rd Gen Intel Scalable processor
  • nVidia
  • nvidia certified
Upgrade with Higher Computing Performance

One Platform, Endless AI Possibilities

The QuantaGrid D75E-4U is more than just an x86-based system built on the Intel® Xeon® platform. It adheres to the NVIDIA MGX™ architecture, offering a modular design that meets diverse AI application and customer demands. This system is compatible with a full range of NVIDIA data center PCIe GPUs, including the RTX PRO™ 6000, H200 NVL, L40S, L4, A2, and A16, enabling unparalleled flexibility and performance.

The NVIDIA H200 NVL/RTX PRO 6000 and Intel® Gaudi® 3 are particularly suited for organizations with data centers seeking low-power, air-cooled enterprise rack designs. It delivers versatile acceleration for AI and HPC workloads of all sizes, making it an ideal choice for enterprises prioritizing efficiency and scalability.

With the QuantaGrid D75E-4U, customers can maximize computing power in compact spaces. The system supports flexible GPU configurations—1, 2, 4, or 8 GPUs—allowing companies to optimize their existing rack infrastructure and tailor performance to their specific requirements.

Higher Thermal Efficiency

  • Supports remote heatsink for better GPU thermal efficiency

  • More power savings with lower fan speed

  • Higher GPU performance due to less pre-heating

 

                                                                                                                                                                                                                            

Upgrade with Higher Computing Performance

Easy Management

  • Secure and dynamic data administration of data center resources with Orqestra (QCT System Manager)
  • Monitors up to 5000 devices per Orqestra module
认证
  • 80plus-platinum
  • BSMI--Taiwan--EMISafety
  • CB-EU
  • CCC-China
  • CE-EU
  • Microsoft Windows  2012 R2
  • Microsoft Windows 2012
处理器
Processor Family
Intel® Xeon® 6 processors
处理器类型
Intel® Xeon® 6 processors
最大散热设计功耗支援
350W
处理器数量
2 Processors
主板规格
主板规格
4U
尺寸
W x H x D (英呎)
17.24 x 6.93 x 31.5
W x H x D (毫米)
438 x 176 x 800
存储
SKU - #1
(12) hot-swappable E1.S SSDs
SKU - #2
(24) hot-swappable E1.S SSDs
存储器
總插槽
(32) DDR5 RDIMM up to 6,400 MHz, (16) MRDIMM up to 8,000 MHz
扩充插槽
SKU - #1
W/O PCIe switch
- (4) DW FHFL PCIe 5.0 x 16 slots for GPU​
- (3) SW FHFL PCIe 5.0 x 16 slots for networking​
SKU - #2
W PCIe switch
- (8) DW FHFL PCIe 5.0 x 16 slots for GPU​
- (4) SW FHFL PCIe 5.0 x 16 slots for networking​
- (1) SW FHHL PCIe 5.0 x 16 slot for networking​
- (1) SW HHHL PCIe 5.0 x 16 slot (reserved)
网络控制器
局域网在主板技术
(1) Dedicated 1 GbE management port
前端I/O端口
前端I/O端口
(1) Power button
(1) VGA
(1) ID button/LED
(2) USB 2.0 ports
电源
电源
3+1 High efficiency redundant hot-plug Titanium 2700W/3200W AC PSU
风扇
风扇
(10) dual rotor fans (9 fans + 1 rotor)
影像
影像
Integrated AST2600
Maximum display resolution is up to 1920x1080p 32bpp@60Hz
后端I/O端口
后端I/O端口
(1) Power button
(1) ID button/LED
(1) Mini display port
(1) COM port (Micro USB TypeB)
(1) USB 3.0 ports
(1) Dedicated LAN port (RJ45) for BMC management
操作环境
操作环境
Operating temperature: 5°C to 35°C
Non-operating temperature: -40°C to 70°C
Operating relative humidity: 50% to 85%RH
Non-operating relative humidity: 10% to 95%RH
可信任平台模块
可信任平台模块
TPM 2.0 SPI module (optional)

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