QuantaGrid D74A-7U
Accelerated Parallel Computing Performance for the Most Extreme AI-HPC Workloads
- Multiple-GPUs Server for HPC / AI Training ( e.g LLMs / NLP ).
- Powered by 2x 4th AMD EPYC9004 Processors and Compatible with Next-Gen AMD EPYC™ Processor in the future.
- Introducing NVIDIA HGX Architecture and Flexible with 8x NVIDIA H100/H200 GPUs or 8x AMD MI300X GPUs.
- 18x SFF All-NVMe Drive Bays for GPUDirect Storage and Boot Drive.
- 10x OCP NIC 3.0 TSFF for GPUDirect RDMA.
- Modularized Design for Easy Serviceability.
Multiple-GPUs Server for HPC / AI Training ( e.g LLMs / NLP )
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Modularized Design for Easy Serviceability
The architecture is designed around a toolless modular philosophy. Major components can be removed from the system chassis without unmounting from the rack for better serviceability and increased system uptime. The modularity in this innovative design allows for forward support of next generation CPUs and GPUs.
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Modularized Design for Easy Serviceability
The architecture is designed around a toolless modular philosophy. Major components can be removed from the system chassis without unmounting from the rack for better serviceability and increased system uptime. The modularity in this innovative design allows for forward support of next generation CPUs and GPUs.
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| 处理器 | |
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| Processor Family |
AMD EPYC™
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| 处理器类型 |
AMD EPYC™ 9004 Series Server Processors
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| 最大散热设计功耗支援 |
cTDP up to 400W
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| 处理器数量 |
2 Processors
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| 内部互连 |
16 GT/s
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| L3缓存 |
Up to 384 MB
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| 主板规格 | |
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| 主板规格 |
7U
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| 尺寸 | |
|---|---|
| W x H x D （英呎） |
17.63" x 12.12" x 34.88"
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| W x H x D （毫米） |
447.8 x 307.85 x 886mm
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| 芯片组 | |
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| 芯片组 |
SoC
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| 存储 | |
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| 存储 |
(18) 2.5" hot-plug NVMe SSD drives
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| 存储器 | |
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| 總插槽 |
24
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| 容量 |
Up to 6TB (256Gx24) of memory capacity
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| 内存类型 |
4800 MHz DDR5 RDIMM
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| 内存大小 |
16G, 32G, 64G, 128G, 256G RDIMM/3DS DIMM
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| 扩充插槽 | |
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| 扩充插槽 |
(2) PCIe 5.0 x16 OCP 3.0 SFF slots (MB)
(10) PCIe 5.0 x16 OCP 3.0 TSFF slots (I/O Board) |
| Expansion Slot_GPGPU baseboard |
SKU - #1
(8) NVIDIA H100/H200 SXM GPU Modules with HGX Baseboard SKU - #2 (8) AMD MI300X GPU Modules with Industry-Standard-Based Universal Baseboard (UBB 2.0) |
| 网络控制器 | |
|---|---|
| 局域网在主板技术 |
Dedicated (1) GbE management port
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| 选配网卡 |
Please refer to our Compatible Component List for more information
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| 前端I/O端口 | |
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| 前端I／O端口 |
(1) Power button/LED
(1) Reset button (1) ID button/LED (1) System status LED (2) USB 3.0 (1) VGA port |
| 电源 | |
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| 电源 |
(6) 3+3 High Efficiency Redundant Hot-Plug 4000W 80 Plus Titanium PSUs
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| 机载存储 | |
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| 机载存储 |
Onboard Storage (2) 2280 M.2 (Optional for Boot Drive)
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| 风扇 | |
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| 风扇 |
(8) hot-swap 9276 dual rotor fans (N+1 redundant)
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| 影像 | |
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| 影像 |
Integrated AST2600
Maximum display resolution is up to 1920x1080p 32bpp@60Hz |
| 系统管理 | |
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| 系统管理 |
Redfish v1.11
IPMI v2.0 Compliant, on board "KVM over IP" support |
| 后端I/O端口 | |
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| 后端I/O端口 |
(1) Power button
(1) ID button/LED (1) USB 3.0 port (1) Mini Display port (1) COM Port (micro USB type-B) (1) RJ45 dedicated mgmt port |
| 操作环境 | |
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| 操作环境 |
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 70°C (-40°F to 158°F) Operating relative humidity: 20% to 85%RH Non-operating relative humidity: 10% to 95%RH |
| 可信任平台模块 | |
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| 可信任平台模块 |
TPM 2.0 SPI module (optional)
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| 重量（限重） | |
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| 重量（限重） |
116.58 kg (257.01 lbs)
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