Rackgo X Leopard Cave

Powerful 2U3N Open Rack v2 Compute Server

  • New Generation Platform with Enhanced Performance
  • Air Cooling Thermal Design for Existing Infrastructure
  • Uniform Scale-out Building Block
  • High Reliability, Serviceability and Availability
  • Open Rack v2 Compatible

技术支持来自

  • intelXeon

Powerful 2U3N Open Rack v2 Compute System

Introducing the Leopard Cave, an Open Compute Project v2 rack compliant multi-node compute system; a next generation platform that infuses the next generation of powerful dual Intel®Xeon® E5-2600 v3, v4 processors with 16 slots of 2400 MHz DDR4 memory for a total capacity of 1024GB to provide impressive high-density computing resources in each node that can handle multiple events concurrently. With up to three independent server nodes, the Leopard Cave is excellent for scale-out solutions in granular approach data centers to maximize hyper-scale performance.

Designed with the holistic principles of the OCP to be vanity free and without gratuitous differentiation, this unpolluted thermal design is devised to optimize airflow through the system to function in existing data center infrastructures. With an ambient operating temperature of up 40°C, power for cooling systems in data centers can be lowered to better protect the environment while considerably reducing operating costs.

The Leopard Cave features a uniform modular design concept with a compartment-design enclosure that allows flexible swapping of any compute or storage module. This enclosure is installed on the Open Rack v2 frame that utilizes a centralized power shelf to deliver all necessary power to each system in the rack through a singular bus bar to better optimize, economize and reduce CAPEX. The rack frame architecture and enclosure is developed to support future hardware solutions to ensure maximum usage of data center infrastructure investments. When upgrading hardware, simply swap any obsolete module with next generation modules.

认证
  • CB-EU
  • CE-EU
  • Microsoft Windows  2012 R2
  • EAC
  • RHEL-5.10RHEL6.5RHEL7.0
  • VMware-READY-CERTIFIED
  • WEEE-Mark
  • VMWare ESXi5.1-Update2ESXi 5.5-Update1
处理器
处理器类型
Intel®Xeon® processor E5-2600 v3 product family
Intel®Xeon® processor E5-2600 v4 product family
处理器数量
2 Processors
内部互连
9.6 / 8.0 / 6.4 GT/s
L3缓存
Up to 55MB
主板规格
主板规格
3 Nodes
2 OU
(Open Rack)
Rackmount
存储
存储
(1) 3.5” fixed drive bay per node
尺寸
W x H x D (英吋)
21.14 x 3.67 x 33.58
W x H x D (毫米)
537 x 93.2 x 853
芯片组
芯片组
Intel® C610
扩充插槽
扩充插槽
(1) PCIe Gen3 x8 OCP mezzanine card per node
(1) PCIe Gen3 x16 FHHL PCIe card per node
(1) PCIe Gen3 x8 FHHL PCIe card per node
存储器
總插槽
16
(per node)
容量
Up to 512GB of memory for RDIMM per node
Up to 1024GB of memory for LRDIMM per node
内存类型
2133/2400 MHz DDR4 RDIMM
内存大小
32GB RDIMM
64GB LRDIMM
前端I/O端口
前端 I/O 端口
(1) USB 3.0 per node
(1) 1GbE RJ45 management port per node
(1) RS232 serial port per node
存储控制器
机载
Intel® C610:
(6) SATA 6Gb/s ports
SATA RAID 0, 1, 10
选配控制器
Please refer to the Compatible Components List for more information
风扇
风扇
(2) Single rotor fan per node
影像
影像
Integrated AST2400 with 8MB DDR3 video memory
系统管理
系统管理
Option 1: AST1250
Option 2: AST2400
IPMI v2.0 Compliant, on board "KVM over IP" support
Quanta Datacenter Manager 2.0/QDCM 2.0 (Optional)
操作环境
操作环境
Operating temperature: 0°C to 40°C (32°F to 104°F)
Non-operating temperature: -40°C to 65°C (-40°F to 149°F)
Operating relative humidity: 20% to 85% RH
Non-operating relative humidity: 40% to 90% RH
可信任平台模块
可信任平台模块
Yes
With TPM 1.2/ 2.0 Option
网络控制器
网络控制器
Support following QCT OCP mezzanine cards (PCIe x8) for network options in front of IO per node:
(1) QCT 1GbE RJ45 dual port OCP mezzanine card or
(1) QCT 10 GbE RJ45 dual port OCP mezzanine card or
(1) QCT 10G/25G SFP+ OCP dual port mezzanine card
选配网卡
Please refer to the Compatible Components List for more information
机架兼容
Rack Compatible
Open Rack v2
注解
注意
Restriction applies. Please contact QCT Sales rep regarding 145W support

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