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QuantaGrid D53XQ-2U

Scale Ahead for the Workload of Tomorrow

  • Ultimate resilience and scalability with up to 10x PCIe 4.0 expansions
  • Optimized for AI acceleration: Support up to 2x dual-width accelerators in 2U system
  • Support All 24x NVMe flash drives as hot tier storage, targeting HPC and enterprise workloads.

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  • 3rd Gen Intel Scalable processor

Ultimate Compute Performance and Security Architecture

 

Performance & Cost Optimized 4-Socket Server

 

  • 3rd Gen Intel® Xeon Scalable Processor Ice Lake based dual socket platform.

  • Up to 3x UPI at 11.2 GT/sec CPU interconnect speed.

  • Advance system cooling support up to 270W CPU TDP per socket

  • Memory capacity up to 8TB with 8 channel DDR4 memory and 12TB with 2nd Gen Intel® Optane™ PMem 200 Series Barlow Pass.

 

Scalability, Flexibility, Capability, All in 2U

 

 

 

  • Built-in AI acceleration: support up to 2x dual-width accelerators in 2U systems

  • Flexible SKU options from 12x 3.5” drive to 24x 2.5” /U.2 drive with PCIe Gen 4

  • Optional rear NVMe as booting device  (Intel VMD supported), or high speed NIC with optional HHHL slots

  • 24x PCIe Gen 4 NVMe drives. For high performance hot tier storage, HPC and enterprise workloads

 

  

Enhanced Security

Performance & Cost Optimized 4-Socket Server
  • Chassis intrusion triggered when top cover removed while AC/DC on, to alter and log any possible breach to your QCT servers.

 

Quick Deployment with Great Serviceability

 

Upgrade with Higher Computing Performance
  • Tool-less, hot-swap designs for drive trays, riser brackets and fan modules.

  • Auto back-up BMC event logs in microSD without opening chassis.

  • Easy service with OCP3.0 pull-tab & ejector without opening chassis.

 

 

 

Easy Management

 

Performance & Cost Optimized 4-Socket Server
  • Secure and dynamic data administration of data center resources with Orqestra (QCT System Manager).

  • Monitor up to 5000 devices per Orqestra module.

 

Zertifizierung
  • 80plus-platinum
  • CB-EU
  • CE-EU
  • cUL (Canada) (Safety)
  • FCC-ClassA-US
Prozessor
Processor Family
3rd gen Intel® Xeon Scalable Family
Prozessortyp
3rd gen Intel® Xeon Scalable processor
Max. TDP Unterstützung
270W
Anzahl Prozessoren
(2) per node
Interne Interconnect
11.2GT/s
L3 Cache
Up to 57MB
Formfaktor
Formfaktor
2U
Abmessungen
B x H x T (inch)
17.3 x 3.4 x 30.7
B x H x T (mm)
440 x 87.5 x 780
Chipsatz
Chipsatz
C621A Series
Massenspeicher
Massenspeicher
2.5" Hot-plug
3.5" Hot-plug
SATA/ SAS/ NVME support
SKU - #1
[ LFF SATA/SAS SKU]:

Front Storage: (12) 3.5"/2.5" hot-plug SATA/SAS
Rear Storage: (4) 3.5"/2.5" hot-plug SATA/SAS + (2) 7mm fixed SATA SSD
SKU - #2
[LFF Tiered SKU]:
Front Storage: (4) 3.5"/2.5" hot-plug SATA/SAS drive + (8) 2.5" hot-plug NVMe/SATA/SAS drives
Rear Storage: (2) 2.5" hot-plug NVMe/SATA/SAS drives (optional)
SKU - #3
[SFF Passthrough SKU]:
Front Storage: (16) 2.5" hot-plug SATA/SAS drive + (8) 2.5" hot-plug NVMe SSD
Rear Storage: (2) 2.5" hot-plug NVMe drives (optional)
SKU - #4
[SFF Expander Pure SATA/SAS SKU]:
Front Storage: (24) 2.5" hot-plug SATA/SAS drives
Rear Storage: (2) 2.5" hot-plug SATA/SAS/NVMe drives (optional)
SKU - #5
[SFF Expander Tiered SKU]:
Front Storage: (16) 2.5" hot-plug SATA/SAS drives + (8) 2.5" hot-plug SATA/SAS/NVMe drives
Rear Storage: (2) 2.5" hot-plug SATA/SAS/NVMe drives (optional)
SKU - #6
[SFF All Flash SKU]
Front Storage: (24) Hot-plug NVMe drives
Rear Storage: (2) 2.5" Hot-plug NVMe drives (optional)
Arbeitsspeicher
Anzahl Slots
32
Kapazität
Up to 8TB DIMM
Up to 12TB DIMM+PMEM (200 series)
Speichertyp
2933 MHz DDR4 RDIMM/LRDIMM
3200 MHz DDR4 RDIMM/LRDIMM
- Intel® Optane™ PMem 200 series (BPS) 128, 256, 512GB supported on selected CPU SKUs
Speichergröße
16G, 32G, 64G, 128G, 256G RDIMM/LRDIMM/3DS DIMM
Erweiterungssteckplatz
SKU - #1
[General Config]

(1) PCIe 4.0 x8 SAS Mezzanine slot
(1) PCIe 4.0 x8 OCP 3.0 SFF Mezzanine slot
(2) PCIe 4.0 x16 FHHL + (4) PCIe 4.0 x8 FHHL slot
Optional (2) PCIe 4.0 x16 HHHL slot
SKU - #2
[Dual Width GPU Config]

(1) PCIe 4.0 x8 SAS Mezzanine slot
(1) PCIe 4.0 x8 OCP 3.0 SFF Mezzanine slot
(2) PCIe 4.0 x16 FHFL + (2) PCIe 4.0 x16 FHHL slot
Optional (2) PCIe 4.0 x16 HHHL slot
SKU - #3
[Single Width GPU Config]

(1) PCIe 4.0 x8 SAS Mezzanine slot
(1) PCIe 4.0 x8 OCP 3.0 SFF Mezzanine slot
(4) PCIe 4.0 x16 FHFL slot
Optional (2) PCIe 4.0 x16 HHHL slot
Netzwerkcontroller
LOM
Dedicated (1) GbE management port
Optionale NIC
Please refer to our Compatible Component List for more information
vordere I/O
Vordere I/O
Power/ID/Reset Buttons
Power/ID/Status LEDs
(2) USB ports
(1) VGA port (Display Priority: First; one device one time)
Festplatten-Controller
Onboard
Intel® 621A
14x SATA3 6Gb/s ports
SATA RAID 0, 1
Optionale Controller
Quanta LSI® PCIe Gen4 3816 12Gb/s SAS mezzanine
Quanta LSI® PCIe Gen4 3916 12Gb/s SAS mezzanine (RAID 0,1,5,6,10,50,60)
Intel® VROC Upgrade Module for PCIe SSD
(Please refer to the CCL for more options)
Netzteil
Netzteil
1+1 High efficiency redundant hot-plug Platinum/Titanium 1200W/1600W/2200W AC PSU
integrierter Speicher
integrierten Speicher
(2) 2230 PCIE M.2 on board for Booting OS
Lüfter
Lüfter
(6) dual rotor fans (11+1 redundant)
System-Management
System-Management
Redfish v1.9
IPMI v2.0 Compliant, on board "KVM over IP" support
Orqestra (QCT System Manager) (Optional)
hintere I/O
hintere I/O
(2) USB 3.0, (1)RS232 serial port, (1) VGA port, (1)Micro USB (COM port), (1) ID LED, (1)PFR LED, (1) MicroSD
Betriebsumgebung
Betriebsumgebung
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 70°C (-40°F to 158°F)
Operating relative humidity: 20% to 85%RH
Non-operating relative humidity: 10% to 95%RH
TPM
TPM
TPM 2.0 SPI module

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Wir können Ihre Anfrage nicht abschließen !

Bitte besuchen Sie uns für weitere Informationen, oder lassen Sie uns wissen, wie wir Ihnen jetzt helfen können.